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Data Sheet June 29, 2009
EHW007A0B Series (Eighth-Brick) DC-DC Converter Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z versions) Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions) High efficiency 92.5% at 12.0V full load (Vin=48Vdc) Industry standard, DOSA compliant footprint 58.4mm x 22.8mm x 8.1mm (2.30 in x 0.9 in x 0.32 in) Low profile height and reduced component skyline Wide input voltage range: 36-75 Vdc Tightly regulated output Constant switching frequency Positive remote On/Off logic Input under/over voltage protection Output overcurrent and overvoltage protection Over-temperature protection Remote sense No reverse current during output shutdown Output Voltage adjust: 90% to 110% of Vo,nom
RoHS Compliant
Applications
Distributed Power Architectures Wireless Networks Access and Optical Network Equipment Enterprise Networks including Power over Ethernet (PoE)
Options
Negative Remote On/Off logic Over current/Over temperature/Over voltage protections (Auto-restart) Heat plate version (-H) Surface Mount version (-S)
Wide operating temperature range (-40C to 85C) Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module UL*Recognized to UL60950-1, CAN/CSA C22.2 No.60950-1, and EN60950-1(VDE 0805-1) Licensed CE mark meets 2006/95/EC directive Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1 2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards ISO**9001 and ISO 14001 certified manufacturing facilities
Description
The EHW007A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 7A of output current and provide a precisely regulated output voltage of 12.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 92.5%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.
* UL is a registered trademark of Underwriters Laboratories, Inc.
CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards
Document No: DS08-002 ver. 1.01 PDF name: ehw007_ds.pdf
Data Sheet June 29, 2009 Absolute Maximum Ratings
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Input Voltage Continuous Transient, operational (100 ms) Operating Ambient Temperature (see Thermal Considerations section) Storage Temperature I/O Isolation voltage (100% factory Hi-Pot tested) All All Tstg -55 125 2250 C Vdc All All All VIN VIN,trans TA -0.3 -0.3 -40 80 100 85 Vdc Vdc C Device Symbol Min Max Unit
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Operating Input Voltage Maximum Input Current (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current (VIN = VIN, nom, module disabled) Inrush Transient Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1H source impedance; VIN, min to VIN, max, IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All Device All All All All Symbol VIN IIN,max IIN,No load IIN,stand-by It
2
Min 36
Typ 48 2.75 70 5
Max 75 3.0
Unit Vdc Adc mA
8 0.5
mA As
2
All
30
mAp-p
All
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer's data sheet for further information.
LINEAGE POWER
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Electrical Specifications (continued)
Parameter Nominal Output Voltage Set-point VIN=VIN, min, IO=IO, max, TA=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance Output Current Output Current Limit Inception (Hiccup Mode ) (VO= 90% of VO, set) Output Short-Circuit Current (VO250mV) ( Hiccup Mode ) Efficiency VIN= VIN, nom, TA=25C, IO=IO, max , VO= VO,set VIN= VIN, nom, TA=25C, IO=0.5IO, max , VO= VO,set Switching Frequency Dynamic Load Response (dIo/dt=0.1A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) (dIo/dt=1.0A/s; VIN = VIN, nom; TA=25C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation Settling Time (Vo<10% peak deviation) All All VO, set VO 11.8 11.64 12.0 12.24 12.36 Vdc % VO, set Device Symbol Min Typ Max Unit
All All All

0.2 0.2 1.0
% VO, set % VO, set % VO, set
All All All All All All CO, max Io
0 0 105
20 50 120 5
30 100 2,000 7 130
mVrms mVpk-pk F Adc % Io Arms
IO, lim
IO, s/c
All All All
fsw
92.5 91.5 400
% % kHz
All All
Vpk ts

3 200

% VO, set s
All All
Vpk ts

5 200

% VO, set s
Isolation Specifications
Parameter Isolation Capacitance Isolation Resistance I/O Isolation Voltage (100% factory Hi-pot tested) Device All All All Symbol Ciso Riso All Min 100 Typ 1000 Max 2250 Unit pF M Vdc
General Specifications
Parameter Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (IO=80%IO, max, TA=40C, airflow = 200 lfm, 90% confidence) Weight (Open Frame) Weight (with Heatplate) Device All All All All Symbol FIT MTBF Min Typ 235.0 4,254,493 21 (0.77) 33 (1.16) Max Unit 10 /Hours Hours g (oz.) g (oz.)
9
LINEAGE POWER
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Data Sheet June 29, 2009 Feature Specifications
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix "1" Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current Logic Low - On/Off Voltage Logic High Voltage - (Typ = Open Collector) Logic High maximum allowable leakage current Turn-On Delay and Rise Times (IO=IO, max , VIN=VIN, nom, TA = 25 C) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = from instant at which VIN=VIN, min until VO = 10% of VO, ) Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (Tdelay from instant at which VIN = VIN, min until Vo=10% of VO,set) Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) Output voltage overshoot - Startup IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range Output Voltage Adjustment Range Output Overvoltage Protection Overtemperature Protection - Hiccup Auto Restart Input Undervoltage Lockout Turn-on Threshold Turn-off Threshold Hysterisis Input Overvoltage Lockout Turn-on Threshold Turn-off Threshold Hysterisis All VOVLO 76 1 79 81 2 83 Vdc Vdc Vdc
o o
Device
Symbol
Min
Typ
Max
Unit
All All All All
Ion/off Von/off Von/off Ion/off
-0.7
0.3 5
1.0 1.2 10
mA Vdc Vdc A
All
Tdelay
20
msec
All All All All All All All All
Tdelay Trise

5
150 12 3 10
msec msec % VO, set % VO, set % VO, set Vdc
O
VSENSE 90 VO, limit Tref VUVLO 30 1 34 32 2 13.8 135
110 16.5 36 3
C
Vdc Vdc Vdc
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Data Sheet June 29, 2009 Characteristic Curves
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
The following figures provide typical characteristics for the EHW007A0B (12.0V, 7A) at 25 C. The figures are identical for either positive or negative remote On/Off logic.
OUTPUT CURRENT OUTPUT VOLTAGE VO (V) (200mV/div)
o
95
EFFICIENCY, (%)
90 85 80 75 70 0 1 2 3 4 5 6 7
OUTPUT CURRENT, IO (A)
Vin = 36V
Vin = 48V
Vin = 75V
Io(A) (2A/div)
TIME, t (100s/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 1.0A/S Dynamic Load Change from 50% to 75% to 50% of full load.
On/Off VOLTAGE OUTPUT VOLTAGE VOn/Off (V) (5V/div) VO (V) (5V/div)
OUTPUT VOLTAGE
VO (V) (50mV/div)
TIME, t (2s/div)
TIME, t (5ms/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE VO (V) (200mV/div)
Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = VIN,NOM, Io = Io,max).
INPUT VOLTAGE OUTPUT VOLTAGE VIN (V) (20V/div) VO (V) (5V/div)
Io(A) (2A/div)
TIME, t (200s/div)
TIME, t (20ms/div)
Figure 3. Transient Response to 0.1A/S Dynamic Load Change from 50% to 75% to 50% of full load.
Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Io = Io,max).
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Data Sheet June 29, 2009 Test Configurations
TO OSCILLOSCOPE LTES T Vin+ 12H
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current Design Considerations
Input Filtering
CURRENT PROBE
33-100F CS 220F E.S.R.<0.1 @ 20C 100kHz Vin-
The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 33100F electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
BATTERY
Safety Considerations
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE0805-1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module's output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module's output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. For input voltages exceeding -60 Vdc but less than or equal to -75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead.
NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12H. Capacitor C S offsets possible battery impedance. Measure current as shown above.
Figure 7. Input Reflected Ripple Current Test Setup.
COPPER STRIP V O (+) SCOPE V O (- ) RESISTIVE LOAD
1uF
10uF GROUND PLANE
NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 8. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact Vin+ Vout+
Rcontact
Rdistribution
VIN
VO
RLOAD
Rdistribution
Rcontact VinVout-
Rcontact
Rdistribution
NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
VO. IO Efficiency = VIN. IIN x 100 %
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Data Sheet June 29, 2009 Feature Description
Remote On/Off
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).
SENSE(+) SENSE(-) VI(+) SUPPL Y II VI(-) VO(+) VO(-) CONT ACT AND DISTRIBUTION LOSSE
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix "1", turns the module off during a logic high and on during a logic low.
Vin+
IO
LOAD
CONT ACT RESIST ANCE
Vout+
Figure 11. Circuit Configuration for remote sense .
Ion/off ON/OFF
TRIM
Von/off
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF.
Vin-
Vout-
Figure 10. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V Von/off 1.2V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the typical maximum Von/off generated by the module is 5V, and the maximum allowable leakage current at Von/off = 5V is 1A. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-).
Overtemperature Protection
To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point o Tref (Figure 13), exceeds 135 C (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature.
Remote Sense
Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of LINEAGE POWER
Output Overvoltage Protection
The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto-restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least
7
Data Sheet June 29, 2009 Feature Descriptions (continued)
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
5.11 x Vo , set x (100 + %) 511 Rtrim - up = - - 10 .22 1.225 x % %
Where
V - V o , set % = desired V o , set x 100
one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin.
For example, to trim-up the output voltage of the module by 5% to 12.6V, Rtrim-up is calculated is as follows:
% = 5
5 . 11 x 12 . 0 x (100 + 5 ) 511 R trim - up = - - 10 . 22 1 . 225 x 5 5
Rtrim -up = 938 .8
The voltage between the VO(+) and VO(-) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max).
VIN(+)
VO(+) Rtrim-up
ON/OFF VOTRIM Rtrim-down VIN(-) VO(-) LOAD
Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be 1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of %
511 - 10 . 22 R trim - down = %
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference point, Tref used in the specifications for open frame modules is shown in Figure 13. For reliable operation this temperature o should not exceed 123 C. The thermal reference point, Tref used in the specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature o should not exceed 110 C.
Where % = V o , set - V desired V o , set
x 100
For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows:
% = 8
511 Rtrim - down = - 10 .22 8
R trim - down = 53 . 655
Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of %: LINEAGE POWER
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
8
2.0 m/s (400 LFM)
Thermal Considerations (continued)
OUTPUT CURRENT, IO (A)
7
6
1.0 m/s (200 LFM)
5
0.5 m/s (100 LFM) NC
AIRFLOW Figure 13. Tref Temperature Measurement Location for Open Frame Module.
4
3 20 30 40 50 60 70
o
80
90
AMBIENT TEMEPERATURE, TA ( C)
Figure 15. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. AIRFLOW
OUTPUT CURRENT, IO (A)
8
7
Figure 14. Tref Temperature Measurement Location for Module with Heatplate.
6
1.0 m/s (200 LFM)
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figure 14. Please refer to the Application Note "Thermal Characterization Process For Open-Frame BoardMounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures.
8
5
0.5 m/s (100 LFM) NC
4
3 20 30 40 50 60 70
o
80
90
AMBIENT TEMEPERATURE, TA ( C)
Figure 16. Output Current Derating for the Module with Heatplate and 0.25 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
8
OUTPUT CURRENT, IO (A)
1.0 m/s (200 LFM)
7
OUTPUT CURRENT, IO (A)
3.0 m/s (600 LFM)
6
0.5 m/s (100 LFM)
7
6
5
NC
5
2.0 m/s (400 LFM) 1.0 m/s (200 LFM) 0.5 m/s (100 LFM) NC
4
4
3 20 30 40 50 60 70
o
80
90
3
AMBIENT TEMEPERATURE, TA ( C)
90
2 20 30 40 50 60 70 80
AMBIENT TEMEPERATURE, TA ( C)
o
Figure 14. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
Figure 17. Output Current Derating for the Module with Heatplate and 0.5 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
300
Thermal Considerations (continued)
8
OUTPUT CURRENT, IO (A)
7
6
0.5 m/s (100 LFM)
NC
5
4
3 20 30 40 50 60 70
o
80
90
AMBIENT TEMEPERATURE, TA ( C)
Figure 18. Output Current Derating for the Module with Heatplate and 1.0 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V.
Surface Mount Information
Pick and Place
The EHW007A0B modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow o temperatures of up to 300 C. The label also carries product information such as product code, serial number and the location of manufacture.
P eak Temp 235oC
250
REFLOW TEMP (C)
200
Heat zo ne max 4oCs -1
Co o ling zo ne 1 oCs -1 -4
150
100
So ak zo ne 30-240s P reheat zo ne max 4oCs -1
Tlim above 205oC
50
0
REFLOW TIME (S)
Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process
240
Figure 17. Pick and Place Location.
MAX TEMP SOLDER (C)
235 230 225 220 215 210 205 200 0 10 20 30 40 50 60
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.
Figure 19. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process
Tin Lead Soldering
The EHW007A0B power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) LINEAGE POWER 10
Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
stored at the following conditions: < 40 C, < 90% relative humidity.
Surface Mount Information (continued)
Lead Free Soldering
The -Z version of the EHW007A0B modules are leadfree (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001).
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 20.
300 Per J-STD-020 Rev. C Peak Temp 260C 250 Cooling Zone
Through-Hole Lead-Free Soldering Information
The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details.
Reflow Temp (C)
200 * Min. Time Above 235C 15 Seconds 150 Heating Zone 1C/Second *Time Above 217C 60 Seconds
100
50
0
Reflow Time (Seconds)
Figure 20. Recommended linear reflow profile using Sn/Ag/Cu solder.
MSL Rating
The EHW007A0B modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when
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Data Sheet June 29, 2009 EMC Considerations
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
The circuit and plots in Figure 21 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
Level 80
[dBV]
70
60
50 x 40 x x xx x
30
20
10
0 150k 300k 500k 1M 2M 3M 4M 5M Frequency [Hz] QP PK 7M 10M 30M
x
x MES MES
CE0508091459_fin CE0508091459_pre
Level 80
[dBV]
70
60
50 + 40 + ++ + +
30
20
10
0 150k 300k 500k 1M 2M 3M 4M 5M Frequency [Hz] AV AV 7M 10M 30M
+
+ MES MES
CE0508091459_fin CE0508091459_pre
Figure 21. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] Top side label includes Lineage Power name, product designation and date code.
Top View*
Side View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom View
Pin 1 2 3 4 5 6 7 8
Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+)
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] * Top side label includes Lineage Power name, product designation and date code.
Top View*
Side View
Bottom View
Pin 1 2 3 4 5 6 7 8 Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+)
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top View
Side View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom View*
* Bottom side label includes Lineage Power name, product designation and date code.
Pin 1 2 3 4 5 6 7 8 Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+)
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Data Sheet June 29, 2009 Recommended Pad Layout
Dimensions are in millimeters and [inches].
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Pin 1 2 3 4 5 6 7 8
Function Vi(+) ON/OFF Vi(-) Vo(-) SENSE(-) TRIM SENSE(+) Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030" X 0.025" RECTANGULAR PIN, USE 0.050" PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA" PIN, USE 0.076" PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
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Data Sheet June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Packaging Details
The surface mount versions of the EHW007A0B (suffix -S) are supplied as standard in the plastic trays shown in Figure 22.
Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the EHW007A0B (suffix -S) surface mount module will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules.
Tray Specification
Material Max surface resistivity Color Capacity Antistatic coated PVC 1012/sq Clear 12 power modules
Figure 22. Surface Mount Packaging Tray
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Data Sheet June 29, 2009 Ordering Information
EHW007A0B Series Eighth-Brick Power Modules 36-75Vdc Input; 12.0Vdc Output; 7A Output Current
Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes Product Codes EHW007A0B41Z EHW007A0B41-HZ EHW007A0B41-SZ Input Voltage 48V (36-75Vdc) 48V (36-75Vdc) 48V (36-75Vdc) Output Voltage 12.0V 12.0V 12.0V Output Current 7A 7A 7A On/Off Logic Negative Negative Negative Connector Type Through hole Through hole Surface mount Comcodes CC109145100 CC109143194 CC109147402
Table 2. Device Coding Scheme and Options Characteristic Form Factor Family Designator Input Voltage Output Current Output Voltage Pin Length Action following Protective Shutdown Options On/Off logic Customer Specific Mechanical Features RoHS Character and Position E H W 007A0 B 6 8 4 1 XY W = Wide Input Voltage Range, 36V -75V 007A0 = 007.0 Amps Rated Output Current B = 12.0 Vout Nominal Omit = No Pin Trim 6 = Pin Length: 3.68 mm 0.25mm , (0.145 in. 0.010 in.) 8 = Pin Length: 2.79 mm 0.25mm , (0.110 in. 0.010 in.) Omit = Latching Mode 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic 1 = Negative Logic XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module H H = Heat plate (not available with -S option) S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used Z Z = RoHS 6/6 Compliant, Lead free Definition E = Eighth Brick
Ratings
Asia-Pacific Headquarters Tel: +65 6416 4283
World Wide Headquarters Lineage Power Corporation 3000 Skyline Drive, Mesquite, TX 75149, USA +1-800-526-7819 (Outside U.S.A.: +1-972-284-2626) www.lineagepower.com e-mail: techsupport1@lineagepower.com
Europe, Middle-East and Africa Headquarters Tel: +49 898 780 672 80
India Headquarters Tel: +91 80 28411633
Lineage Power reserves the right to m ake changes to t he product(s) or inf ormation contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. (c) 2008 Lineage Pow er C orporation, (Mesquite, Texas) All I nternational Rights Res erved.
Document No: DS08-002 ver. 1.01 PDF name: ehw007_ds.pdf

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